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November 22,2005 - InStack™ to Automate Stackup Process at Interconnect Technologies

InStack™ to Automate Stackup Process at Interconnect Technologies
 
Billerica, MA - 22-Nov-2005, Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced that Interconnect Technologies (Springfield, MO) has purchased InStack™ automated design stackup software for use in its pre-production process for high layer and complex bare printed circuit board manufacturing.

Commenting on the purchase, Mr. Mike Davis, Pre-Production Manager at Interconnect Technologies, said: 'Our decision to purchase InStack was based on its ability to significantly reduce the time required to solve complex stackups with multiple impedance constraints per layer. We expect this to greatly improve our pre-production process cycle time and quality on complex jobs, while also reducing costs.'

Mr. Barry Cohen, President and CEO at Orbotech, Inc., stated, 'InStack has been designed specifically to address manufacturers' production challenges by reducing stackup design time from hours to minutes with excellent results and no need for an expert operator. We appreciate very much Litton's decision to purchase this solution from us and look forward to helping them achieve their goals.'

About InStack

InStack developed by Frontline PCB Solutions™, an Orbotech Valor company, is a standalone module within the InPlan™ automated engineering and process planning system. Stackup is the most challenging task in high layer and complex PCB pre-production. In an instant, InStack helps select the most cost-efficient material set available that meets thickness and impedance constraints. InStack replaces calculators, tables, estimates and guesswork with fast, high-quality stackup design via one unified tool.

About Interconnect Technologies

Interconnect Technologies, a unit of Northrop Grumman's Component Technologies sector, manufactures complex, technology-driven, high-performance electronic and electro-optical printed circuit boards and backpanel assemblies through cabinet-level assembly for the world's leaders in the electronics industry. Headquartered in Springfield, Mo., it has operations in Scotland, California, China and Malaysia. For more information, visit www.littoninterconnect.com